Difference between revisions of "YPR078C"

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(UW-Stout/Copper FA21)
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The average doubling time for YPR078W unstressed was 47.55, while stressed it was 54.68. From these observations we can conclude that while stressed with our .5 mM CuSO4 solution, the YBR184W strain grew approximately 13% slower. The unstressed version also had a higher overall size.
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The average doubling time for YPR078W unstressed was 296 minutes, while stressed it was 354. From these observations we can conclude that while stressed with our .5 mM CuSO4 solution, the YBR184W strain grew approximately 17% slower. The unstressed version also had a higher overall size.
  
  

Latest revision as of 14:28, 21 December 2021

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Systematic name YPR078C
Gene name
Aliases
Feature type ORF, Uncharacterized
Coordinates Chr XVI:698265..697147
Primary SGDID S000006282


Description of YPR078C: Putative protein of unknown function; possible role in DNA metabolism and/or in genome stability; expression is heat-inducible[1][2]




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Community Commentary

About Community Commentary. Please share your knowledge!

This gene is part of the UW-Stout Orphan Gene Project. Learn more here.

UW-Stout/Heat Shock FA21

Heat Shock.jpeg

YPRO78C (D)

  • The trials showed very consistent results when heat shocked. The growth rate was consistent but just less clusters than the control plate.

Nitrogen Starvation

YPR078C Nitrogen21.jpg

  • In the YPR078C gene, there is a slight increase in growth on the plate that does not contain NH₄. Overall, there is no sign that this particular strain did anything significant to the genes; therefore, makes it resistant to the stress it's being put into.

UW-Stout/Bud Scars FA21

Cells grown with this gene (YPR078C) knocked out had an average of 1.30 bud scars per cell while the wild type (BY-RY4735) had 0.85 bud scars per cell. Of 109 YPR078C cells counted, 142 bud scars were seen. This indicated that the YPR078C gene slows reproduction rate and thus bud scarring in yeast cells.

pH

pH knockout.jpg

YPR078C

  • When this strain was exposed to a citric acid buffer with a pH of 2.6. At first, the yeast growth appeared stunted and then began to slowly trend upward

Protocol [[1]]



UW-Stout/G418 FA21

YPR078C Vs BY4735 G418.png

The YPR078C yeast strain doubling time without any stress was 275 minutes which is much slower than the wild type with 182 minutes. When both strains were stressed by G418 they YPR078C doubling time was 257 minutes and the wild type was 178 minutes. (These times are averaged between three trials) Protocol [[2]]








UW-Stout/Ethanol FA21

Yeast ToutureV2.jpg

  • The Yeast Strain of YPR078C was affected by the 18.5 % Ethanol it was almost the exact same as the growth curve as the YMR221C growth curve.

UW-Stout/Ethanol FA21


UW-Stout/Copper FA21

ypr0.jpg

The average doubling time for YPR078W unstressed was 296 minutes, while stressed it was 354. From these observations we can conclude that while stressed with our .5 mM CuSO4 solution, the YBR184W strain grew approximately 17% slower. The unstressed version also had a higher overall size.



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References

See Help:References on how to add references

  1. Perkins EL, et al. (1999) Yeast and human genes that affect the Escherichia coli SOS response. Proc Natl Acad Sci U S A 96(5):2204-9 SGD PMID 10051619
  2. Sakaki K, et al. (2003) Response of genes associated with mitochondrial function to mild heat stress in yeast Saccharomyces cerevisiae. J Biochem 134(3):373-84 SGD PMID 14561723

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